NXP USA Inc. ISP1362EE-T

表面安装

YES

终端数量

64

Package Description

FBGA, BGA64,10X10,20

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA64,10X10,20

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

ISP1362EE-T

Package Code

FBGA

Package Shape

SQUARE

Manufacturer

恩智浦半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Risk Rank

8.57

无铅代码

无

子类别

总线控制器

端子位置

BOTTOM

终端形式

BALL

端子间距

0.5 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B64

资历状况

不合格

电源

3.3 V

温度等级

INDUSTRIAL