onsemi NCP9002FCT2G

表面安装

YES

Contact plating

gold-plated

Number of pins

4

终端数量

9

Rohs Code

有

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ON SEMICONDUCTOR

Part Package Code

BGA

Package Description

LEAD FREE, CSP-9

Bandwidth-Nom

20 kHz

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Output Power-Nom

1.3 W

Package Body Material

PLASTIC/EPOXY

Package Code

VFBGA

Package Shape

SQUARE

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Type of connector

pin strips

Connector

socket

Kind of connector

female

Spatial orientation

straight

Contacts pitch

2.54mm

Electrical mounting

THT

Connector pinout layout

1x4

Gross weight

0.31 g

Operating temperature

-40...163°C

JESD-609代码

e3

无铅代码

有

ECCN 代码

EAR99

端子表面处理

Matte Tin (Sn)

HTS代码

8542.33.00.01

端子位置

BOTTOM

终端形式

BALL

峰值回流焊温度（摄氏度）

260

功能数量

1

端子间距

0.5 mm

Reach合规守则

compliant

Current rating

1.5A

时间@峰值回流温度-最大值(s)

40

引脚数量

9

JESD-30代码

S-PBGA-B9

资历状况

不合格

电源电压-最大值(Vsup)

5.5 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2.2 V

通道数量

1

座位高度-最大

0.66 mm

消费者集成电路类型

音频放大器

Rated voltage

60V

谐波失真

0.04%

个人资料

beryllium copper

长度

1.45 mm

宽度

1.45 mm

Plating thickness

0.75µm

Flammability rating

UL94V-0