ON Semiconductor 74HC253N

表面安装

NO

终端数量

16

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP16,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

74HC253N

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

4.48

Prop.

44 ns

JESD-609代码

e4

端子表面处理

Nickel/Palladium/Gold (Ni/Pd/Au)

子类别

Multiplexer/Demultiplexers

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

2

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T16

资历状况

不合格

电源

2/6 V

温度等级

INDUSTRIAL

输入数量

4

输出特性

3-STATE

逻辑IC类型

MULTIPLEXER

最大 I(ol)

0.006 A