ON Semiconductor FIN212ACBFX

表面安装

YES

终端数量

36

Package Description

2.50 X 2.50 MM, 0.40 MM PITCH, LEAD FREE, BGA-36

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Package Body Material

UNSPECIFIED

Operating Temperature-Min

-30 °C

Supply Voltage-Nom

2.775 V

Operating Temperature-Max

70 °C

Manufacturer Part Number

FIN212ACBFX

Package Code

VFBGA

Package Shape

SQUARE

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.7

Part Package Code

BGA

端子位置

BOTTOM

终端形式

BALL

功能数量

1

端子间距

0.4 mm

Reach合规守则

unknown

引脚数量

36

JESD-30代码

S-XBGA-B36

资历状况

COMMERCIAL

温度等级

OTHER

座位高度-最大

0.8 mm

通信IC类型

电信电路

宽度

2.5 mm

长度

2.5 mm