ON Semiconductor MAX809RW

表面安装

YES

终端数量

6

Package Description

TSSOP, TSSOP6,.08

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP6,.08

Operating Temperature-Min

-40 °C

Operating Temperature-Max

105 °C

Rohs Code

无

Manufacturer Part Number

MAX809RW

Supply Voltage-Nom (Vsup)

3 V

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Threshold Voltage-Nom

+2.63V

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.74

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

电源管理电路

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G6

资历状况

不合格

电源

3 V

温度等级

INDUSTRIAL

可调阈值

NO

供应电流-最大值(Isup)

0.06 mA