ON Semiconductor MC10175PD

表面安装

NO

终端数量

16

Package

Bulk

厂商

PEI-Genesis

Product Status

活跃

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP16,.3

Operating Temperature-Min

-30 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

MC10175PD

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

飞思卡尔半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Risk Rank

5.92

系列

*

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

FF/Latches

技术

ECL10K

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-PDIP-T16

电源

-5.2 V

温度等级

OTHER

比特数

5

逻辑IC类型

D 拉锁