ON Semiconductor MC10176LDS

表面安装

NO

终端数量

16

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Manufacturer

飞思卡尔半导体

Manufacturer Part Number

MC10176LDS

Operating Temperature-Max

85 °C

Operating Temperature-Min

-30 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Description

DIP, DIP16,.3

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Part Life Cycle Code

Obsolete

Risk Rank

5.92

Rohs Code

无

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

FF/Latches

技术

ECL10K

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

6

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

电源

-5.2 V

温度等级

OTHER

逻辑IC类型

D FLIP-FLOP

触发器类型

MASTER-SLAVE