ON Semiconductor MC10H117LDS

表面安装

NO

终端数量

16

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP16,.3

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

MC10H117LDS

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

飞思卡尔半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Gates

技术

ECL

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

温度等级

COMMERCIAL

逻辑IC类型

OR-AND/OR-AND-INVERT GATE

施密特触发器

NO