ON Semiconductor MC10H123LDS

表面安装

NO

终端数量

16

Risk Rank

5.92

Ihs Manufacturer

MOTOROLA INC

Part Life Cycle Code

Obsolete

Manufacturer

摩托罗拉半导体产品

Package Shape

RECTANGULAR

Package Code

DIP

Manufacturer Part Number

MC10H123LDS

Rohs Code

无

Operating Temperature-Max

70 °C

Package Equivalence Code

DIP16,.3

Package Body Material

CERAMIC

Package Style

IN-LINE

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Gates

技术

ECL

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

JESD-30代码

R-XDIP-T16

电源

-5.2 V

温度等级

COMMERCIAL

施密特触发器

NO

达到SVHC

unknown