ON Semiconductor MC10H135LD

表面安装

NO

终端数量

16

Rohs Code

无

Risk Rank

5.92

Part Life Cycle Code

Obsolete

Package Style

IN-LINE

Package Shape

RECTANGULAR

Package Equivalence Code

DIP16,.3

Package Description

DIP, DIP16,.3

Package Code

DIP

Package Body Material

CERAMIC

Operating Temperature-Max

70 °C

Max

250000000 Hz

Manufacturer Part Number

MC10H135LD

Manufacturer

摩托罗拉半导体产品

Ihs Manufacturer

MOTOROLA INC

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

FF/Latches

技术

ECL

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

2

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

温度等级

COMMERCIAL

逻辑IC类型

J-K FLIP-FLOP

触发器类型

MASTER-SLAVE

电源电流-最大值(ICC)

75 mA