ON Semiconductor MC10H189LDS

表面安装

NO

终端数量

16

Operating Temperature-Max

70 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Risk Rank

5.9

Ihs Manufacturer

MOTOROLA INC

Part Life Cycle Code

Obsolete

Rohs Code

无

Manufacturer Part Number

MC10H189LDS

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

温度等级

COMMERCIAL

逻辑IC类型

INVERTER

施密特触发器

NO