ON Semiconductor MC14081BALD

底架

Cable

表面安装

NO

终端数量

14

RoHS

Compliant

Package Description

DIP, DIP14,.3

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP14,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Rohs Code

无

Manufacturer Part Number

MC14081BALD

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

飞思卡尔半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Risk Rank

5.89

包装

Bulk

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

性别

Male

子类别

Gates

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T14

电源

5/15 V

温度等级

MILITARY

电缆长度

190 mm

逻辑IC类型

AND GATE

施密特触发器

NO

辐射硬化

无