ON Semiconductor MC14094BCLD

表面安装

NO

终端数量

16

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP16,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

MC14094BCLD

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

飞思卡尔半导体

Part Life Cycle Code

Obsolete

Ihs Manufacturer

MOTOROLA SEMICONDUCTOR PRODUCTS

Risk Rank

5.89

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

移位寄存器

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

电源

5/15 V

温度等级

INDUSTRIAL

比特数

8