ON Semiconductor MM74C915J

表面安装

NO

终端数量

18

Package Description

DIP, DIP18,.3

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP18,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

MM74C915J

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Texas

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NATIONAL SEMICONDUCTOR CORP

Risk Rank

5.92

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

算术电路

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T18

资历状况

不合格

温度等级

INDUSTRIAL