ON Semiconductor MN503H/B

表面安装

NO

终端数量

18

Package Description

DIP, DIP18,.3

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP18,.3

Operating Temperature-Min

-55 °C

Risk Rank

5.92

Ihs Manufacturer

MICRO NETWORKS CORP

Part Life Cycle Code

Obsolete

Manufacturer

Spectrum Microwave

Package Shape

RECTANGULAR

Package Code

DIP

Manufacturer Part Number

MN503H/B

Rohs Code

无

Operating Temperature-Max

125 °C

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

模数转换器

技术

BIPOLAR

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T18

资历状况

不合格

温度等级

MILITARY

比特数

8

转换器类型

A/D CONVERTER

筛选水平

MIL-STD-883 Class B (Modified)