ON Semiconductor MV8865

表面安装

NO

终端数量

16

Package Description

DIP, DIP16,.3

Package Style

IN-LINE

Package Body Material

CERAMIC

Package Equivalence Code

DIP16,.3

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

MV8865

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Dynex Semiconductor

Part Life Cycle Code

Obsolete

Ihs Manufacturer

GEC PLESSEY SEMICONDUCTORS

Risk Rank

5.85

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

电信信令电路

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

资历状况

不合格

电源

5/12 V

温度等级

INDUSTRIAL

通信IC类型

DTMF信号电路