ON Semiconductor N08L163WC2AB2-70I

表面安装

YES

终端数量

48

EU RoHS

Compliant

ECCN (US)

3A991.b.2.a

Automotive

无

PPAP

无

Chip Density (bit)

8M

Number of Words

512K

Number of Bits/Word (bit)

16

Address Bus Width (bit)

19

Timing Type

Asynchronous

Max. Access Time (ns)

70

Minimum Operating Supply Voltage (V)

2.3

Typical Operating Supply Voltage (V)

3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

15

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Mounting

表面贴装

Package Height

0.96

Package Width

6

Package Length

8

PCB changed

48

Standard Package Name

BGA

Supplier Package

BGA

Lead Shape

Ball

Package Description

FBGA, BGA48,6X8,30

Package Style

GRID ARRAY, FINE PITCH

Number of Words Code

512000

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA48,6X8,30

Operating Temperature-Min

-40 °C

Access Time-Max

70 ns

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

N08L163WC2AB2-70I

Package Code

FBGA

Package Shape

RECTANGULAR

Manufacturer

NanoAmp Solutions, Inc.

Part Life Cycle Code

接触制造商

Ihs Manufacturer

NANOAMP SOLUTIONS INC

Risk Rank

5.79

零件状态

Obsolete

子类别

SRAMs

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.75 mm

Reach合规守则

unknown

引脚数量

48

JESD-30代码

R-PBGA-B48

资历状况

不合格

电源

3/3.3 V

温度等级

INDUSTRIAL

端口的数量

1

操作模式

ASYNCHRONOUS

电源电流-最大值

0.015 mA

组织结构

512KX16

输出特性

3-STATE

内存宽度

16

待机电流-最大值

0.00001 A

记忆密度

8388608 bit

并行/串行

PARALLEL

I/O类型

COMMON

内存IC类型

标准SRAM

待机电压-最小值

1.8 V