Philips CBT3257D

表面安装

YES

终端数量

16

Package

Bulk

厂商

Banner Engineering Corporation

Product Status

活跃

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP16,.25

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

CBT3257D

Supply Voltage-Nom (Vsup)

5 V

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.69

系列

*

JESD-609代码

e4

端子表面处理

Nickel/Palladium/Gold (Ni/Pd/Au)

子类别

其他逻辑IC

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G16

资历状况

不合格

电源

5 V

温度等级

INDUSTRIAL