Philips ISP1161BD

表面安装

YES

终端数量

64

Risk Rank

5.77

Ihs Manufacturer

飞利浦半导体

Part Life Cycle Code

Transferred

Manufacturer

Philips Semiconductors

Package Shape

SQUARE

Package Code

QFP

Manufacturer Part Number

ISP1161BD

Rohs Code

无

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Equivalence Code

QFP64,.47SQ,20

Package Body Material

PLASTIC/EPOXY

Package Style

FLATPACK

Package Description

QFP, QFP64,.47SQ,20

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

总线控制器

端子位置

QUAD

终端形式

鸥翼

端子间距

0.5 mm

JESD-30代码

S-PQFP-G64

资历状况

不合格

电源

3.3/5 V

温度等级

INDUSTRIAL

达到SVHC

unknown