Philips ISP1161BM

表面安装

YES

终端数量

64

Package Description

QFP, QFP64,.35SQ,16

Package Style

FLATPACK

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

QFP64,.35SQ,16

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

ISP1161BM

Package Code

QFP

Package Shape

SQUARE

Manufacturer

Philips Semiconductors

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Risk Rank

5.81

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

总线控制器

端子位置

QUAD

终端形式

鸥翼

端子间距

0.4 mm

Reach合规守则

unknown

JESD-30代码

S-PQFP-G64

资历状况

不合格

电源

3.3/5 V

温度等级

INDUSTRIAL