Philips Semiconductors BAS70-06W

表面安装

YES

材料

synthetic polyolefin

Diameter of the protected wire (cable)

12.8…24 mm

Diameter before shrinking

26.0 mm

Diameter after shrinking

12.5 mm

Wall thickness before shrinking

0.55 mm

Wall thickness after shrinking

0.9 mm

Gross weight

38.00

Transport packaging size/quantity

102*20*20/300

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Forward Voltage-Max (VF)

0.41 V

Operating Temperature-Max

150 °C

包装

in packs of 1 meter lengths

JESD-609代码

e3

ECCN 代码

EAR99

类型

Heat-shrink tube without adhesive layer

端子表面处理

哑光锡

颜色

red

峰值回流焊温度（摄氏度）

260

Reach合规守则

unknown

二极管类型

接收电极

输出电流-最大值

0.07 A

Operating temperature range

-55…+125 °C

Rep Pk反向电压-最大值

70 V

最大非代表Pk前进电流

0.1 A

Shrinkage ratio

2 : 1

Shrink temperature

+70…+120 °C

Operating voltage

600 V