Philips Semiconductors UBA1707TS

表面安装

YES

终端数量

28

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Package Description

SSOP, SSOP28,.3

Operating Temperature-Max

70 °C

Operating Temperature-Min

-25 °C

Package Body Material

PLASTIC/EPOXY

Package Code

SSOP

Package Equivalence Code

SSOP28,.3

Package Shape

RECTANGULAR

Package Style

SMALL OUTLINE, SHRINK PITCH

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

R-PDSO-G28

资历状况

不合格

温度等级

OTHER