Philips Semicons 10158F-B

表面安装

NO

终端数量

16

Manufacturer Part Number

10158F-B

Rohs Code

无

Part Life Cycle Code

Transferred

Ihs Manufacturer

飞利浦半导体

Package Description

DIP, DIP16,.3

Risk Rank

5.86

Operating Temperature-Max

85 °C

Operating Temperature-Min

-30 °C

Package Body Material

CERAMIC

Package Code

DIP

Package Equivalence Code

DIP16,.3

Package Shape

RECTANGULAR

Package Style

IN-LINE

Prop.

4.8 ns

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

4

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T16

电源

-5.2 V

温度等级

OTHER

输入数量

2

逻辑IC类型

MULTIPLEXER

电源电流-最大值(ICC)

53 mA