Pulse W99888F

表面安装

YES

终端数量

115

Manufacturer Part Number

W99888F

Rohs Code

有

Part Life Cycle Code

Transferred

Ihs Manufacturer

WINBOND ELECTRONICS CORP

Risk Rank

5.71

Operating Temperature-Max

70 °C

Package Body Material

PLASTIC/EPOXY

Package Code

FBGA

Package Equivalence Code

BGA115,11X11,25

Package Shape

SQUARE

Package Style

GRID ARRAY, FINE PITCH

端子位置

BOTTOM

终端形式

BALL

端子间距

0.635 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B115

资历状况

不合格

电源

3.3 V

温度等级

COMMERCIAL

电源电流-最大值

85 mA