QP Semiconductor 5962-9201201MLA

表面安装

NO

终端数量

24

Part Life Cycle Code

Transferred

Ihs Manufacturer

QP SEMICONDUCTOR INC

Part Package Code

DIP

Package Description

DIP,

Clock Frequency-Max

10.5 MHz

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC, GLASS-SEALED

Package Code

DIP

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Max

5.5 V

Supply Voltage-Min

4.5 V

Supply Voltage-Nom

5 V

JESD-609代码

e0

ECCN 代码

3A001.A.2.C

端子表面处理

锡铅

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

Reach合规守则

unknown

引脚数量

24

JESD-30代码

R-GDIP-T24

资历状况

不合格

温度等级

MILITARY

传播延迟

35 ns

组织结构

12 DEDICATED INPUTS, 0 I/O

可编程逻辑类型

OT PLD

筛选水平

MIL-STD-883

输出功能

REGISTERED

专用输入数量

12