Qualcomm Q2240I-3S1

表面安装

YES

终端数量

64

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

QUALCOMM

Package Description

QFP, QFP64,.7X.95,40

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

QFP

Package Equivalence Code

QFP64,.7X.95,40

Package Shape

RECTANGULAR

Package Style

FLATPACK

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

HTS代码

8542.39.00.01

端子位置

QUAD

终端形式

鸥翼

端子间距

1 mm

Reach合规守则

unknown

JESD-30代码

R-PQFP-G64

资历状况

不合格

温度等级

INDUSTRIAL

供应电流-最大值(Isup)

0.1 mA