Qualtek Electronics Corp. BM30-12
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BM30-12
1988-BM30-12
集成电路(IC)
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大陆
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BM30-12 datasheet pdf and Integrated Circuits (ICs) product details from Qualtek Electronics Corp. stock available at utmel
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BM30-12详情
Qualtek Electronics Corp. BM30-12重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
表面安装
YES
终端数量
6
晶体管元件材料
SILICON
Package Style
FLANGE MOUNT
Package Shape
ROUND
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Operating Temperature-Max
200 °C
Risk Rank
5.65
Package Description
FLANGE MOUNT, O-CXFM-F6
Ihs Manufacturer
ASI SEMICONDUCTOR INC
Part Life Cycle Code
活跃
Manufacturer Part Number
BM30-12
ECCN 代码
EAR99
端子位置
UNSPECIFIED
终端形式
FLAT
Reach合规守则
unknown
引脚数量
6
JESD-30代码
O-CXFM-F6
资历状况
不合格
配置
Single
箱体转运
EMITTER
极性/通道类型
NPN
最大耗散功率(Abs)
65 W
集电极电流-最大值(IC)
8 A
集电极-发射器电压-最大值
18 V
最高频段
甚高频段
BM30-12拓展信息
Qualtek Electronics Corp.
Qualtek Electronics Corp.
Qualtek Electronics Corp.
Qualtek Electronics Corp.
Qualtek Electronics Corp.
Qualtek Electronics Corp.
Qualtek Electronics Corp.
Qualtek Electronics Corp.
Qualtek Electronics Corp.
Qualtek Electronics Corp.







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