Renesas 74ALVC74PG

表面安装

YES

终端数量

14

Package Style

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Moisture Sensitivity Levels

1

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

TSSOP14,.25

Manufacturer Package Code

PG14

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

74ALVC74PG

Supply Voltage-Nom (Vsup)

3.3 V

Package Code

TSSOP

Package Shape

RECTANGULAR

Manufacturer

Integrated Device Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Risk Rank

5.72

Part Package Code

TSSOP

JESD-609代码

e0

无铅代码

无

端子表面处理

Tin/Lead (Sn85Pb15)

子类别

FF/Latches

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

功能数量

2

端子间距

0.635 mm

Reach合规守则

not_compliant

引脚数量

14

JESD-30代码

R-PDSO-G14

资历状况

不合格

Brand Name

集成设备技术

电源

3.3 V

温度等级

INDUSTRIAL

逻辑IC类型

D FLIP-FLOP

最大 I(ol)

0.024 A

触发器类型

积极优势