Renesas 9FGL06P1A000KILF

表面安装

YES

终端数量

40

Package Description

HVQCCN,

Package Style

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Moisture Sensitivity Levels

3

Package Body Material

UNSPECIFIED

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

3.3 V

Reflow Temperature-Max (s)

未说明

Supply Voltage-Min

3.135 V

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

9FGL06P1A000KILF

Package Code

HVQCCN

Package Shape

SQUARE

Manufacturer

Integrated Device Technology Inc

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEGRATED DEVICE TECHNOLOGY INC

Supply Voltage-Max

3.465 V

Risk Rank

5.2

JESD-609代码

e3

ECCN 代码

EAR99

端子表面处理

哑光锡

HTS代码

8542.39.00.01

技术

CMOS

端子位置

QUAD

终端形式

无铅

峰值回流焊温度（摄氏度）

260

端子间距

0.4 mm

Reach合规守则

compliant

JESD-30代码

S-XQCC-N40

温度等级

INDUSTRIAL

uPs/uCs/外围ICs类型

CLOCK GENERATOR, PROCESSOR SPECIFIC

座位高度-最大

1 mm

主时钟/晶体频率-名

40 MHz

输出时钟频率-最大值

100 MHz

宽度

5 mm

长度

5 mm