Renesas HD64F2318VF25

表面安装

YES

引脚数

100

终端数量

100

Package Description

QFP, QFP100,.75X.99

Package Style

FLATPACK

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

QFP100,.75X.99

Operating Temperature-Min

-20 °C

Supply Voltage-Nom

3.3 V

Operating Temperature-Max

70 °C

Rohs Code

有

Manufacturer Part Number

HD64F2318VF25

RAM(byte)

8192

Package Code

QFP

Package Shape

RECTANGULAR

Manufacturer

Renesas Electronics Corporation

ROM(word)

262144

Part Life Cycle Code

Obsolete

Ihs Manufacturer

RENESAS ELECTRONICS CORP

Risk Rank

5.82

Part Package Code

QFP

子类别

Microcontrollers

技术

CMOS

端子位置

QUAD

终端形式

鸥翼

端子间距

0.635 mm

Reach合规守则

compliant

JESD-30代码

R-PQFP-G100

资历状况

不合格

电源

3.3 V

温度等级

COMMERCIAL

速度

25 MHz

位元大小

16

处理器系列

H8S/2000

只读存储器可编程性

FLASH