R7F7016514ABG-C#HC1详情
Renesas R7F7016514ABG-C#HC1重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
安装类型
表面贴装
包装/外壳
233-FBGA
供应商器件包装
233-FBGA (15x15)
Package
零售包装
厂商
Glenair
Product Status
活跃
Number of I/Os
174
Data Converters
A/D 38x10b, 32x12b
Moisture Sensitive
有
Qualification
AEC-Q100
Shipping Restrictions
This product may require additional documentation to export from the United States.
Factory Pack QuantityFactory Pack Quantity
1000
Manufacturer
Renesas Electronics
Brand
Renesas Electronics
RoHS
Details
Maximum Clock Frequency
240 MHz
Supply Voltage-Max
5.5 V
Supply Voltage-Min
3 V
Mounting Styles
SMD/SMT
Interface Type
CAN, I2C, SPI, UART
Data RAM Size
512 kB
系列
*
操作温度
-40°C ~ 125°C (TA)
包装
Reel
子类别
Microcontrollers - MCU
电压 - 供电
3V ~ 5.5V
振荡器类型
Internal
速度
240MHz
内存大小
512K x 8
核心处理器
RH850G3KH
周边设备
DMA, PWM, WDT
程序存储器类型
FLASH
芯尺寸
32-Bit
程序内存大小
4MB (4M x 8)
连接方式
CANbus, CSI, I²C, LINbus, SPI, UART/USART
数据总线宽度
32 bit
产品类别
32-bit Microcontrollers - MCU
EEPROM 大小
64K x 8
产品类别
32-bit Microcontrollers - MCU
R7F7016514ABG-C#HC1拓展信息
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America








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