R7FA2E1A52DLM#HC0详情
Renesas R7FA2E1A52DLM#HC0重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
安装类型
表面贴装
包装/外壳
25-UFBGA, WLCSP
供应商器件包装
25-WLCSP (2.14x2.27)
Package
Bulk
Base Product Number
120228
厂商
Molex
Product Status
活跃
Number of I/Os
27
Data Converters
A/D 12x12b SAR
Moisture Sensitive
有
Shipping Restrictions
This product may require additional documentation to export from the United States.
Factory Pack QuantityFactory Pack Quantity
2500
Manufacturer
Renesas Electronics
Brand
Renesas Electronics
RoHS
Details
系列
*
操作温度
-40°C ~ 85°C (TA)
包装
Reel
子类别
Microcontrollers - MCU
界面
Serial I2C/SCI/SPI/U
振荡器类型
Internal
速度
48MHz
内存大小
16K x 8
电压 - 供电 (Vcc/Vdd)
1.6V ~ 5.5V
核心处理器
ARM® Cortex®-M23
周边设备
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
程序存储器类型
FLASH
芯尺寸
32-Bit
程序内存大小
32 KB
连接方式
I²C, SmartCard, SPI, UART/USART
数据总线宽度
32 Bit
产品类别
ARM Microcontrollers - MCU
EEPROM 大小
4K x 8
产品类别
ARM Microcontrollers - MCU
设备核心
ARM Cortex-M23
R7FA2E1A52DLM#HC0拓展信息
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America








哦! 它是空的。