R7FA2E2A32DBY#HC1详情
Renesas R7FA2E2A32DBY#HC1重要参数规格及、参数值,及相似型号如下:
- 参数名参数值全选
- 参数名参数值全选
安装类型
Panel Mount, Through Hole
包装/外壳
16-UFBGA, WLCSP
越来越多的功能
Flange
外壳材料
不锈钢
供应商器件包装
16-WLCSP (1.84x1.87)
Package
零售包装
Primary Material
Metal
厂商
Glenair
Product Status
活跃
Contact Materials
Copper Alloy
Contact Finish Mating
Gold
Number of I/Os
11
Base Product Number
R7FA2E2
Data Converters
A/D 4x12b SAR
Shipping Restrictions
This product may require additional documentation to export from the United States.
Factory Pack QuantityFactory Pack Quantity
2000
Manufacturer
Renesas Electronics
Brand
Renesas Electronics
RoHS
Details
操作温度
-65°C ~ 175°C
系列
806
包装
Reel
终端
Solder
连接器类型
Plug, Male Pins
颜色
Silver
紧固类型
Threaded
子类别
Microcontrollers - MCU
方向
E
外壳完成
Passivated
外壳尺寸-插入
34-4
振荡器类型
Internal
速度
48MHz
内存大小
8K x 8
电压 - 供电 (Vcc/Vdd)
1.6V ~ 5.5V
核心处理器
ARM® Cortex®-M23
周边设备
AES, DMA, LVD, POR, PWM, Temp Sensor, TRNG, WDT
程序存储器类型
FLASH
芯尺寸
32-Bit
程序内存大小
16KB (16K x 8)
连接方式
I²C, I³C, SCI, SmartCard, SPI, UART/USART
产品类别
ARM Microcontrollers - MCU
EEPROM 大小
2K x 8
特征
Ground
产品类别
ARM Microcontrollers - MCU
R7FA2E2A32DBY#HC1拓展信息
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America








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