Renesas UPD77642BF1-GA9-A

表面安装

YES

终端数量

393

Package Description

LFBGA,

Package Style

GRID ARRAY, LOW PROFILE, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-10 °C

Supply Voltage-Nom

1.15 V

Supply Voltage-Min

1.1 V

Operating Temperature-Max

70 °C

Manufacturer Part Number

UPD77642BF1-GA9-A

Package Code

LFBGA

Package Shape

SQUARE

Manufacturer

Renesas Electronics Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

RENESAS ELECTRONICS CORP

Supply Voltage-Max

1.2 V

Risk Rank

8.46

HTS代码

8542.31.00.01

技术

CMOS

端子位置

BOTTOM

终端形式

BALL

端子间距

0.65 mm

Reach合规守则

unknown

JESD-30代码

S-PBGA-B393

温度等级

COMMERCIAL

uPs/uCs/外围ICs类型

微处理器电路

座位高度-最大

1.51 mm

宽度

16 mm

长度

16 mm