Renesas Electronics HD74HC238FP(EL-E)

表面安装

YES

终端数量

16

ECCN (US)

EAR99

Logic Family

HC

Demultiplexing Capability

1-of-8

Number of Elements per Chip

1

Number of Element Inputs

3

Number of Input Enables per Element

3

Number of Element Outputs

8

Number of Output Enables per Element

0

Maximum Propagation Delay Time @ Maximum CL (ns)

26@6V|[email protected]|150@2V

Absolute Propagation Delay Time (ns)

190

Process Technology

CMOS

Maximum Low Level Output Current (mA)

5.2

Maximum High Level Output Current (mA)

-5.2

Minimum Operating Supply Voltage (V)

2

Typical Operating Supply Voltage (V)

5|2.5|3.3

Maximum Operating Supply Voltage (V)

6

Maximum Quiescent Current (mA)

0.004

Propagation Delay Test Condition (pF)

50

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Standard Package Name

SOP

Supplier Package

SOP

Mounting

表面贴装

Package Height

2(Max)

Package Length

10.06

Package Width

5.5

PCB changed

16

Lead Shape

Gull-wing

Package Description

5.50 X 10.06 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, SOP-16

Package Style

小概要

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

未说明

Operating Temperature-Max

85 °C

Rohs Code

有

Manufacturer Part Number

HD74HC238FPEL-E

Supply Voltage-Nom (Vsup)

4.5 V

Package Code

SOP

Package Shape

RECTANGULAR

Manufacturer

Renesas Electronics Corporation

Part Life Cycle Code

不推荐

Ihs Manufacturer

RENESAS ELECTRONICS CORP

Risk Rank

8.17

Part Package Code

SOIC

零件状态

NRND

ECCN 代码

EAR99

HTS代码

8542.31.00.01

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

未说明

功能数量

1

端子间距

1.27 mm

Reach合规守则

compliant

引脚数量

16

JESD-30代码

R-PDSO-G16

极性

Non-Inverting

电源电压-最大值(Vsup)

6 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2 V

家人

HC/UH

逻辑功能

Decoder/Demultiplexer

座位高度-最大

2.2 mm

输出极性

TRUE

逻辑IC类型

OTHER DECODER/DRIVER

传播延迟(tpd)

190 ns

输入调节

STANDARD

宽度

5.5 mm

长度

10.06 mm

RoHS状态

RoHS non-compliant