Renesas Electronics HD74LS10P(E)

表面安装

NO

终端数量

14

ECCN (US)

EAR99

Logic Family

LS

Number of Elements per Chip

3

Number of Element Inputs

3-IN

Number of Output Enables per Element

0

Number of Selection Inputs per Element

0

Number of Element Outputs

1

Maximum Propagation Delay Time @ Maximum CL (ns)

15@5V

Absolute Propagation Delay Time (ns)

15

Process Technology

Bipolar

Maximum Low Level Output Current (mA)

8

Maximum High Level Output Current (mA)

-0.4

Minimum Operating Supply Voltage (V)

4.75

Typical Operating Supply Voltage (V)

5

Maximum Operating Supply Voltage (V)

5.25

Propagation Delay Test Condition (pF)

15

Minimum Operating Temperature (°C)

-20

Maximum Operating Temperature (°C)

75

Standard Package Name

DIP

Supplier Package

PDIP

Mounting

通孔

Package Height

5.06(Max) - 0.51(Min)

Package Length

19.2

Package Width

6.3

PCB changed

14

Lead Shape

通孔

Package Description

DP-14

Package Style

IN-LINE

Moisture Sensitivity Levels

1

Load Capacitance (CL)

15 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP14,.3

Operating Temperature-Min

-20 °C

Reflow Temperature-Max (s)

未说明

Operating Temperature-Max

75 °C

Rohs Code

有

Manufacturer Part Number

HD74LS10P-E

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Renesas Electronics Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

RENESAS ELECTRONICS CORP

Risk Rank

5.29

Part Package Code

DIP

Prop.

15 ns

无铅代码

有

零件状态

Obsolete

HTS代码

8542.39.00.01

子类别

Gates

技术

TTL

端子位置

DUAL

终端形式

THROUGH-HOLE

峰值回流焊温度（摄氏度）

未说明

功能数量

3

端子间距

2.54 mm

Reach合规守则

compliant

引脚数量

14

JESD-30代码

R-PDIP-T14

资历状况

不合格

电源

5 V

温度等级

商业扩展

家人

LS

逻辑功能

NAND

输入数量

3

座位高度-最大

5.06 mm

逻辑IC类型

NAND GATE

最大 I(ol)

0.008 A

传播延迟(tpd)

15 ns

施密特触发器

NO

电源电流-最大值(ICC)

3.3 mA

宽度

7.62 mm

长度

19.2 mm

RoHS状态

RoHS non-compliant