Renesas Electronics HD74LV08AFPEL

表面安装

YES

终端数量

14

ECCN (US)

EAR99

Logic Family

LV

Number of Elements per Chip

4

Number of Element Inputs

2-IN

Number of Output Enables per Element

0

Number of Selection Inputs per Element

0

Number of Element Outputs

1

Maximum Propagation Delay Time @ Maximum CL (ns)

[email protected]|7.9@5V|[email protected]

Absolute Propagation Delay Time (ns)

20

Process Technology

CMOS

Maximum Low Level Output Current (mA)

12

Maximum High Level Output Current (mA)

-12

Minimum Operating Supply Voltage (V)

2

Typical Operating Supply Voltage (V)

5|2.5|3.3

Maximum Operating Supply Voltage (V)

5.5

Maximum Quiescent Current (uA)

20

Propagation Delay Test Condition (pF)

50

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Standard Package Name

SOP

Supplier Package

SOP

Mounting

表面贴装

Package Height

2(Max)

Package Length

10.06

Package Width

5.5

PCB changed

14

Lead Shape

Gull-wing

Package Description

SOP-14

Package Style

小概要

Load Capacitance (CL)

50 pF

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

SOP14,.3

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

未说明

Operating Temperature-Max

85 °C

Rohs Code

无

Manufacturer Part Number

HD74LV08AFPEL

Supply Voltage-Nom (Vsup)

2.5 V

Package Code

SOP

Package Shape

RECTANGULAR

Manufacturer

Renesas Electronics Corporation

Part Life Cycle Code

活跃

Ihs Manufacturer

RENESAS ELECTRONICS CORP

Risk Rank

5.06

Part Package Code

SOIC

Prop.

14 ns

包装

卷带

无铅代码

有

零件状态

活跃

HTS代码

8542.39.00.01

子类别

Gates

包装方式

TAPE AND REEL

技术

CMOS

端子位置

DUAL

终端形式

鸥翼

峰值回流焊温度（摄氏度）

未说明

功能数量

4

端子间距

1.27 mm

Reach合规守则

unknown

引脚数量

14

JESD-30代码

R-PDSO-G14

资历状况

不合格

电源电压-最大值(Vsup)

5.5 V

电源

3.3 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

2 V

家人

LV/LV-A/LVX/H

逻辑功能

AND

输入数量

2

座位高度-最大

2.2 mm

逻辑IC类型

AND GATE

最大 I(ol)

0.006 A

传播延迟(tpd)

20 ns

施密特触发器

NO

宽度

5.5 mm

长度

10.06 mm

RoHS状态

RoHS non-compliant