Renesas Electronics America CDP1866D
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CDP1866D
2038-CDP1866D
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CDP1866D datasheet pdf and Integrated Circuits (ICs) product details from Renesas Electronics America stock available at utmel
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CDP1866D详情
Renesas Electronics America CDP1866D重要参数规格及、参数值,及相似型号如下:
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表面安装
NO
终端数量
18
Manufacturer Part Number
CDP1866D
Rohs Code
无
Part Life Cycle Code
Obsolete
Ihs Manufacturer
RCA SOLID STATE
Package Description
DIP, DIP18,.3
Risk Rank
5.91
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
CERAMIC
Package Code
DIP
Package Equivalence Code
DIP18,.3
Package Shape
RECTANGULAR
Package Style
IN-LINE
JESD-609代码
e0
端子表面处理
Tin/Lead (Sn/Pb)
端子位置
DUAL
终端形式
THROUGH-HOLE
端子间距
2.54 mm
Reach合规守则
unknown
JESD-30代码
R-XDIP-T18
资历状况
不合格
温度等级
INDUSTRIAL
CDP1866D拓展信息
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America







哦! 它是空的。