Renesas Electronics America HD64F2238BFA13I

表面安装

YES

引脚数

100

终端数量

100

Manufacturer Part Number

HD64F2238BFA13I

Part Life Cycle Code

Obsolete

Ihs Manufacturer

RENESAS ELECTRONICS CORP

Part Package Code

QFP

Package Description

QFP, QFP100,.63SQ,20

Risk Rank

5.78

Operating Temperature-Max

85 °C

Operating Temperature-Min

-40 °C

Package Body Material

PLASTIC/EPOXY

Package Code

QFP

Package Equivalence Code

QFP100,.63SQ,20

Package Shape

SQUARE

Package Style

FLATPACK

RAM(byte)

16384

ROM(word)

262144

端子位置

QUAD

终端形式

鸥翼

端子间距

0.5 mm

Reach合规守则

compliant

JESD-30代码

S-PQFP-G100

资历状况

不合格

电源

2.5/3.3 V

温度等级

INDUSTRIAL

速度

13.5 MHz

电源电流-最大值

40 mA

位元大小

16

处理器系列

H8S/2000

只读存储器可编程性

FLASH