Renesas Electronics America HSB276S
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HSB276S
2038-HSB276S
集成电路(IC)
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HSB276S datasheet pdf and Integrated Circuits (ICs) product details from Renesas Electronics America stock available at utmel
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HSB276S详情
Renesas Electronics America HSB276S重要参数规格及、参数值,及相似型号如下:
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表面安装
YES
二极管元件材料
SILICON
终端数量
3
Manufacturer Part Number
HSB276S
Part Life Cycle Code
Transferred
Ihs Manufacturer
HITACHI LTD
Part Package Code
SC-70
Package Description
R-PDSO-G3
Risk Rank
5.75
Number of Elements
2
Operating Temperature-Max
125 °C
Package Body Material
PLASTIC/EPOXY
Package Shape
RECTANGULAR
Package Style
小概要
ECCN 代码
EAR99
HTS代码
8541.10.00.60
端子位置
DUAL
终端形式
鸥翼
Reach合规守则
unknown
引脚数量
3
JESD-30代码
R-PDSO-G3
资历状况
不合格
配置
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
二极管类型
混频器芯片
二极管电容-最大值
0.9 pF
HSB276S拓展信息
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America







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