Renesas Electronics America M65831AP
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M65831AP
2038-M65831AP
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M65831AP datasheet pdf and Integrated Circuits (ICs) product details from Renesas Electronics America stock available at utmel
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M65831AP详情
Renesas Electronics America M65831AP重要参数规格及、参数值,及相似型号如下:
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表面安装
NO
终端数量
24
Manufacturer Part Number
M65831AP
Part Life Cycle Code
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
Part Package Code
DIP
Package Description
0.600 INCH, 13 X 31.10 MM, 3.80 MM HEIGHT, 2.54 MM PITCH, DIP-24
Risk Rank
5.46
Operating Temperature-Max
75 °C
Operating Temperature-Min
-20 °C
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
ECCN 代码
EAR99
HTS代码
8542.39.00.01
端子位置
DUAL
终端形式
THROUGH-HOLE
功能数量
1
端子间距
2.54 mm
Reach合规守则
compliant
引脚数量
24
JESD-30代码
R-PDIP-T24
资历状况
不合格
电源电压-最大值(Vsup)
5.5 V
温度等级
商业扩展
电源电压-最小值(Vsup)
4.5 V
通道数量
2
座位高度-最大
5.5 mm
消费者集成电路类型
混响回路
谐波失真
0.5%
长度
31.1 mm
宽度
15.24 mm
M65831AP拓展信息
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America
Renesas Electronics America







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