Rochester Electronics 22V10-15/BLA

表面安装

NO

终端数量

24

Manufacturer Part Number

22V10-15/BLA

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NXP SEMICONDUCTORS

Part Package Code

DIP

Package Description

DIP,

Risk Rank

5.04

Clock Frequency-Max

50 MHz

Number of I/O Lines

10

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC, GLASS-SEALED

Package Code

DIP

Package Shape

RECTANGULAR

Package Style

IN-LINE

Supply Voltage-Max

5.5 V

Supply Voltage-Nom

5 V

Supply Voltage-Min

4.5 V

ECCN 代码

3A001.A.2.C

HTS代码

8542.39.00.01

端子位置

DUAL

终端形式

THROUGH-HOLE

端子间距

2.54 mm

Reach合规守则

unknown

引脚数量

24

JESD-30代码

R-GDIP-T24

资历状况

不合格

温度等级

MILITARY

传播延迟

15 ns

组织结构

11 DEDICATED INPUTS, 10 I/O

座位高度-最大

5.08 mm

可编程逻辑类型

EE PLD

输出功能

MACROCELL

专用输入数量

11

宽度

7.62 mm