Rochester Electronics 27256-25

表面安装

NO

终端数量

28

Package Description

DIP-28

Package Style

IN-LINE

Number of Words Code

32000

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Access Time-Max

250 ns

Operating Temperature-Max

70 °C

Manufacturer Part Number

27256-25

Number of Words

32768 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Microchip Technology Inc

Part Life Cycle Code

活跃

Ihs Manufacturer

MICROCHIP TECHNOLOGY INC

Risk Rank

5.39

技术

NMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

Reach合规守则

compliant

JESD-30代码

R-CDIP-T28

电源电压-最大值(Vsup)

5.5 V

温度等级

COMMERCIAL

电源电压-最小值(Vsup)

4.5 V

操作模式

ASYNCHRONOUS

组织结构

32KX8

内存宽度

8

记忆密度

262144 bit

并行/串行

PARALLEL

内存IC类型

UVPROM