Rochester Electronics 5962-8752502MCA

表面安装

NO

终端数量

20

Package Description

DIP, DIP14,.3

Package Style

CHIP CARRIER

Load Capacitance (CL)

50 pF

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Package Equivalence Code

DIP14,.3

Operating Temperature-Min

-55 °C

Operating Temperature-Max

125 °C

Manufacturer Part Number

5962-8752502MCA

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Max

100000000 Hz

Risk Rank

5.47

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

锡铅

附加功能

FOUR 2:1 MUX FOLLOWED BY REGISTER

HTS代码

8542.39.00.01

子类别

FF/Latch

技术

CMOS

端子位置

QUAD

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-XDIP-T14

资历状况

Qualified

电源电压-最大值(Vsup)

5.5 V

电源

5 V

温度等级

MILITARY

电源电压-最小值(Vsup)

4.5 V

比特数

4

家人

ACT

输出极性

TRUE

逻辑IC类型

D FLIP-FLOP

最大 I(ol)

0.024 A

筛选水平

38535Q/M;38534H;883B

触发器类型

积极优势

传播延迟(tpd)

10 ns

fmax-Min

95 MHz