Rochester Electronics 5962-9214801QRA

Lead Shape

通孔

Supplier Package

CDIP

Standard Package Name

DIP

PCB changed

20

Package Length

25.02(Max)

Package Width

7.87(Max)

Package Height

4.57(Max)

Mounting

通孔

Supplier Temperature Grade

Military

Maximum Operating Temperature (°C)

125

Minimum Operating Temperature (°C)

-55

Maximum Power Dissipation (mW)

500

Maximum Operating Supply Voltage (V)

5.5

Minimum Operating Supply Voltage (V)

4.5

Maximum Quiescent Current (uA)

30000

Maximum High Level Output Current (mA)

-24

Maximum Low Level Output Current (mA)

48

Input Level

TTL

Process Technology

BiCMOS

Propagation Delay Test Condition (pF)

50

Maximum Propagation Delay Time @ Maximum CL (ns)

4.5@5V

Absolute Propagation Delay Time (ns)

7.5

Bus Hold

无

Number of Direction Control Inputs

1 Low/High

Number of Input Enables per Element

0

Number of Output Enables per Element

1 Low

Number of Selection Inputs per Element

0

Number of Channels per Chip

8

Number of Elements per Chip

1

Data Flow Direction

Bi-Directional

Logic Family

ABT

PPAP

无

Automotive

无

HTS

8542.39.00.01

ECCN (US)

EAR99

EU RoHS

不合规

零件状态

活跃

引脚数量

20

输出类型

3-State

极性

Non-Inverting

逻辑功能

Bus Transceiver

输出电平

TTL