Rochester Electronics 8501001YC

表面安装

YES

终端数量

68

Package Description

QFF,

Package Style

FLATPACK

Package Body Material

CERAMIC, METAL-SEALED COFIRED

Operating Temperature-Min

-55 °C

Supply Voltage-Nom

5 V

Supply Voltage-Min

4.75 V

Operating Temperature-Max

125 °C

Manufacturer Part Number

8501001YC

Clock Frequency-Max

8 MHz

Package Code

QFF

Package Shape

SQUARE

Manufacturer

Defense Logistics Agency

Part Life Cycle Code

活跃

Ihs Manufacturer

DEFENSE LOGISTICS AGENCY

Supply Voltage-Max

5.25 V

Risk Rank

5.59

Part Package Code

QFP

ECCN 代码

3A001.A.2.C

HTS代码

8542.31.00.01

技术

CMOS

端子位置

QUAD

终端形式

FLAT

端子间距

1.27 mm

Reach合规守则

unknown

引脚数量

68

JESD-30代码

S-CQFP-F68

资历状况

Qualified

温度等级

MILITARY

速度

8 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR

位元大小

16

座位高度-最大

2.69 mm

地址总线宽度

20

外部数据总线宽度

16

宽度

24.195 mm

长度

24.195 mm