Rochester Electronics AM27C010-155DIB

表面安装

NO

终端数量

32

Package Description

DIP,

Package Style

IN-LINE

Number of Words Code

128000

Package Body Material

CERAMIC, GLASS-SEALED

Operating Temperature-Min

-40 °C

Access Time-Max

150 ns

Operating Temperature-Max

85 °C

Manufacturer Part Number

AM27C010-155DIB

Number of Words

131072 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.56

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-GDIP-T32

电源电压-最大值(Vsup)

5.25 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

4.75 V

操作模式

ASYNCHRONOUS

组织结构

128KX8

座位高度-最大

5.588 mm

内存宽度

8

记忆密度

1048576 bit

并行/串行

PARALLEL

内存IC类型

UVPROM

宽度

15.24 mm

长度

42.1005 mm