Rochester Electronics AM27C512-175DIB

表面安装

NO

终端数量

2

Body Orientation

Straight

Voltage, Rating

850VDC/600VAC

Product Depth (mm)

26.2(mm)

Shell Size / Insert Arrangement

11-2

Operating Temp Range

-65C to 200C

Termination Method

Crimp

Product Diameter (mm)

Not Required(mm)

Mounting Styles

Wall

Contact Materials

铍铜

Rad Hardened

无

Contact Classification

2Signal

Package Description

DIP,

Package Style

IN-LINE

Number of Words Code

64000

Package Body Material

CERAMIC, GLASS-SEALED

Operating Temperature-Min

-40 °C

Access Time-Max

170 ns

Operating Temperature-Max

85 °C

Manufacturer Part Number

AM27C512-175DIB

Number of Words

65536 words

Supply Voltage-Nom (Vsup)

5 V

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Rochester Electronics LLC

Part Life Cycle Code

活跃

Ihs Manufacturer

ROCHESTER ELECTRONICS LLC

Risk Rank

5.76

类型

Circular

性别

RCP

技术

CMOS

端子位置

DUAL

终端形式

THROUGH-HOLE

功能数量

1

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

R-GDIP-T28

接头数量

2(POS)

触点性别

PIN

电源电压-最大值(Vsup)

5.25 V

温度等级

INDUSTRIAL

电源电压-最小值(Vsup)

4.75 V

端口的数量

1(Port)

操作模式

ASYNCHRONOUS

家人

D38999

组织结构

64KX8

座位高度-最大

5.588 mm

内存宽度

8

记忆密度

524288 bit

并行/串行

PARALLEL

内存IC类型

UVPROM

外壳电镀

化学镍

应力消除

无

产品长度(mm)

33.66(mm)

宽度

15.24 mm

长度

37.1475 mm

产品高度(mm)

26.2(mm)