Rochester Electronics AM27S25ALMB

表面安装

YES

终端数量

32

Manufacturer Part Number

AM27S25ALMB

Rohs Code

无

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Package Description

QCCN, LCC32,.45X.55

Risk Rank

5.92

Access Time-Max

25 ns

Number of Words

512 words

Number of Words Code

512

Operating Temperature-Max

125 °C

Operating Temperature-Min

-55 °C

Package Body Material

CERAMIC

Package Code

QCCN

Package Equivalence Code

LCC32,.45X.55

Package Shape

RECTANGULAR

Package Style

CHIP CARRIER

Usage Level

Military grade

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

端子位置

QUAD

终端形式

无铅

端子间距

1.27 mm

Reach合规守则

compliant

JESD-30代码

R-XQCC-N32

资历状况

不合格

温度等级

MILITARY

组织结构

512X8

内存宽度

8

记忆密度

4096 bit

筛选水平

MIL-STD-883 Class B (Modified)

内存IC类型

OTP ROM