Rochester Electronics AM29C117GCB

表面安装

NO

终端数量

68

RoHS

Non-Compliant

Package Description

PGA, PGA68,11X11

Package Style

网格排列

Package Body Material

CERAMIC

Package Equivalence Code

PGA68,11X11

Supply Voltage-Nom

5 V

Operating Temperature-Max

70 °C

Rohs Code

无

Manufacturer Part Number

AM29C117GCB

Package Code

PGA

Package Shape

SQUARE

Manufacturer

AMD

Part Life Cycle Code

Obsolete

Ihs Manufacturer

ADVANCED MICRO DEVICES INC

Risk Rank

5.63

JESD-609代码

e0

端子表面处理

Tin/Lead (Sn/Pb)

子类别

Microprocessors

技术

CMOS

端子位置

PERPENDICULAR

终端形式

PIN/PEG

端子间距

2.54 mm

Reach合规守则

unknown

JESD-30代码

S-XPGA-P68

电源

5 V

温度等级

COMMERCIAL

速度

19.6 MHz

uPs/uCs/外围ICs类型

MICROPROCESSOR, RISC

电源电流-最大值

170 mA

位元大小

16